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Laser marking machines
Laser welding machines
basic information
Release time:
2019-03-25
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HV850C

Product description

Applications:

Can be widely used in automation machine parts, molds, medical, electronics, machinery, automotive, aircraft, aerospace, shipbuilding, defense and other fields of product processing.

 

Specifications:

Item

Unit

 HV850C

Working area

X/Y/Z axis stroke

mm

800/520/550

Minimum distance from the spindle nose to the worktable

mm

120~670

Work table

Table size

mm

1000*500

Max. load

Kg

450

T-slot size

mm

5-18*110

Main drive

Max rotation speed

rpm

12000

Max torque(S6 40% DC)

Nm

95

Rated torque(S1 100% DC)

Nm

45

Max power(S6 40% DC)

Kw

15

Rated power(S1 100% DC)

Kw

7

Tool charger

Tool type

 

BT40

Tool magazine

Pockets

24

Tool magazine form

 

Knife arm

Max tool diameter (full tools/adjacent tools)

mm

80/150

Max tool length

mm

350

Max tool weight

Kg

8

Tool-tool change time(T to T)

sec

3.9

Chip-chip change time(C to C)

sec

5.9

Feed

Feed velocity(X/Y/Z)

m/min

30/30/30

Rapid moving speed(X/Y/Z)

m/min

48/48/48

Acceleration(X/Y/Z)

m/s2

10/10/10

Linear guide size(X/Y/Z)

mm

35/35/35

Ball screw size(X/Y/Z)

∮* incline

32/32/40

Position accuracy(X/Y/Z)

mm

0.01/300

Repeated accuracy(X/Y/Z)

mm

±0.005

Mechnical data

Mechnical size(with water tank)

mm

2874*2575*2720

Mechnical weight(without water tank)

Kg

4000

Control system

 

Mitsubishi  M80 or Siemens 828D 

 

 

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