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basic information
Release time:
2019-03-26
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UV laser cutting machine HDZ-WUVC100 for wafer products

Product description

Application:

Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing

 

Specification:

Machine model

HDZ-WUVC100

HDZ-WUVC200

Laser power

15W

15W

Laser wavelength

355nm

355nm

XY axis repeated positioning precision

±1µm

±1µm

θ axis repeated positioning precision

±15s

±15s

Cutting line width

>15µm

>15µm

Cutting depth

>25µm

>25µm

Cutting speed (*The cutting speed varies from different products)

100mm/s

100mm/s

Loading and unloading mode

Manual

Robot carrying; automatic edge searching

Processing product type

2 inch-12 inch wafers

2 inch-12 inch wafers

Power supply

AC 220V,50Hz

AC 220V,50Hz

 

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UV laser cutting machine HDZ-WUVC100 for wafer products