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Laser marking machines
Laser welding machines
basic information
Release time:
2019-03-26
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Automatic IC laser marking machine HDZ-SIC200

Product description

Application:

Applicable for the packaged IC marking of DIP, QFN and BGA.

 

Specification:

Machine model

HDZ-SIC100

HDZ-SIC200

Marking scope

320mm*160mm

320mm*160mm

Product specification

L: 160-320mm; W: 30-80mm

L: 160-320mm; W: 30-80mm

Font

TFT and SHX; with font library module modification program

Final processing repeated positioning precision

±0.1mm

±0.1mm

UPH

1200 pieces/h (idle)

1200 pieces/h (idle)

Power supply

AC 220V, 50/60Hz

AC 220V, 50/60Hz

Air source

0.6-0.8 MPa

0.6-0.8 MPa

Overall dimension

2525mm*1665mm*2000mm

2515mm*1420mm*2000mm

 

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